Main Content

(Nano)structure and characterization facilities

Transmission electron microscopy (TEM)

Double Cs-corrected TEM JEM 2200FS

  • high tension: 80 and 200 kV
  • Cs-correctors (CEOS) for the probe forming as well as imaging system
  • in-column energy filter
  • energy dispersive X-ray detector (Bruker)
  • two high angle annular dark field detectors
  • bright field detector
  • 2k x 2k camera (Ultrascan Gatan)
  • fast 2k x 2k camera (Orius Gatan)
  • pixelated detector (PNDetector)
  • analytical double tilt sample holder (JEOL)
  • liquid nitrogen sample holder (Gatan)
  • electrothermal sample holder (Protochips Fusion)
  • tomography holder (Fischione)
  • gas cell (Protochips Atmosphere)
  • liquid cell (Protochips Poseidon)
  • inert gas / vacuum transfer holder (Melbuild)

TEM JEM 3010

  • high tension: 100 ... 300 kV
  • ultra-high resolution pole piece
  • 2k x 2k camera (Ultrascan Gatan)

Image simulations

  • STEMsalabim
  • JEMS
  • HREM for reconstruction of exit wave function amplitude and phase
  • HREM for Z-contrast imaging simulation (absorptive potential method)
  • geometric phase analysis
  • peak pair analysis

TEM sample preparation

  • polishing (Multiprep Allied)
  • dimpling (Fischione)
  • ion milling (PIPS Gatan)
  • gentle milling (Nanomill Fischione)
  • plama cleaning (Fischione)
  • cryo-microtom (Leica)

Further Electron Microscopes and sample preparation equipment can be found here.

Focussed Ion Beam and Scanning Electron Microscopy

Helios 5 Hydra CX PFIB - Dual-Beam Analytical SEM and Plasma FIB

  • electron gun with hot field emitter cathode
  • focussed ion gun
  • four gas plasma sources (Xe, Ar, O, N)
  • ToFWerk Time-of-flight secondary ion mass spectrometer (SIMS)
  • EDX
  • Cryostage
  • inert and vacuum gas transfer (clean connect)
  • hight current processing (60 nA - 200 nA) with protective shutter
  • stage bias and beam deceleration up to 4000 V
  • charge neutralizer (flood gun)
  • oxygen plasma cleaner
  • carbon, platin and tungsten gas injection

JEOL JIB 4610F, dual beam FIB/SEM

  • thermal field emission gun (Schottky)
  • gallium ion source
  • carbon and tungsten gas injection systems
  • backscattered and secondary electron detector
  • micro manipulator (Kleindiek)
  • microgripper (Kleindiek)
  • EDX detector, Bruker XFlash 5010, 10 mm2 active area
  • electron backscatter detection (EBSD, Bruker)

SEM Hitachi cold field emission gun

  • high tension: 5 ... 30 kV
  • secondary electron detector
  • backscattered electron detector
  • energy dispersive X-ray analysis (EDX) (Oxford)
  • electron beam induced current (EBIC)

Atomic force microscopy (AFM)

  • Digital Instruments Nanoscope IIIa

X-ray diffraction

  • high resolution optics
  • open detector
  • reciprocal space mapping
  • GIXS (gracing incidence X-ray scattering)
  • XRR (X-ray reflectivity)

Photoluminescence (PL)

  • Ar-ion laser
  • excitation spectroscopy
  • absorption spectroscopy
  • photo-current spectroscopy
  • reflection spectroscopy
  • 5 - 350 K
  • laser diode measurement
  • wafer PL and reflectivity mapping (accent mapper; solid state lasers @ 532 and 980 nm)

Magnetotransport/Hall

  • Hall, conductivity
  • 0 - 0.8 T
  • 10 - 500 K